Collaboration Research Centers and Facilities

Cooperative Research and Development Center for Advanced Materials

Naoya MASAHASHI

Head/Prof.Naoya MASAHASHI

Rie UMETSU

Prof.Rie UMETSU

  • Prof. Koki TAKANASHI
  • Prof. Tadashi FURUHARA
  • Prof. Toyohiko J. KONNO
  • Prof. Akihiko CHIBA
  • Prof. Kazumasa SUGIYAMA
  • Prof. Akira YOSHIKAWA
  • Prof. Hidemi KATO
  • Assoc. Prof. Satoshi SEMBOSHI
  • Assoc. Prof. Rodion V. BELOSLUDOV
  • Assist. Prof. Noriharu YODOSHI
  • Assist. Prof. Yan ZHANG
  • Assist. Prof. Yuta KIMURA

Advanced Materials - Realizing New Technologies for the Future -

This center was established in 1987 as the research center for the development of new advanced materials, process technology and analysis method for innovation. The Center was reorganized to the current in 2013 through Laboratory for Advanced Materials (LAM) and Advanced Research Center of Metallic Glasses (ARCMG). The Center develops various materials and processes in the field of social infrastructure, energy consumption, environmental protection, information and biotechnology, and aims to deepen material science by elucidating the mechanism of function and establishing guidelines for material design.

material fabrication, microstructural controlling, material characterization, material function, collaborative research
Histological images at the proximal (a, c) and distal part (b, d) of hot water treated (a, b) and untreated (c, d) anodized TiNbSn implanted into the femur.

Histological images at the proximal (a, c) and distal part (b, d) of hot water treated (a, b) and untreated (c, d) anodized TiNbSn implanted into the femur.

Si based alloy  powder quenched by gas-atomization (a) appearance of gas-atomization, (b) SEM Image of the powder, (c) internal pore distribution captured by X-ray CT (after reconstructive tomograph).

Si based alloy powder quenched by gas-atomization (a) appearance of gas-atomization, (b) SEM Image of the powder, (c) internal pore distribution captured by X-ray CT (after reconstructive tomograph).

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